Innovation
U.S. 300 mm Chip Manufacturer Selects EAGLEi 300 FOUP Inspection Technology for Production
For precise pre- and post-clean carrier measurement evaluation
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EAGLEi systems are used in major semiconductor fabs throughout the world, improving fab yield by offering accurate, programmable multipoint wafer carrier inspection as a pre- and post-clean step to ensure only carriers within tolerance reenter production. EAGLEi 200 is available for 2-in. to 200 mm wafer cassette and carrier inspection, and EAGLEi 300 for automated 300 mm FOUP and FOSB wafer-carrier inspection.
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منبع: https://www.qualitydigest.com/inside/innovation-news/us-300-mm-chip-manufacturer-selects-eaglei-300-foup-inspection-technology
(SHELLBACK Semiconductor Technology: Coopersburg, PA) — SHELLBACK Semiconductor Technology, at the forefront of supplying capital equipment solutions to emerging semiconductor markets worldwide, has sold its popular EAGLEi 300 FOUP inspection system to a major 300 mm chip manufacturer in the U.S.
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“Over the past three years, EAGLEi300 has become the standard for 300 mm foundries and high-volume manufacturers throughout Asia,” says Wayne Jeveli, CEO of SHELLBACK. “We’re thrilled to see major North American customers benefiting from our best-in-class inspection technology as they invest in capacity expansions and new fab construction. Well-known as the most accurate carrier inspection system available today, EAGLEi is an obvious choice to improve fab yield.”
The sale, to an industry-leading global electronics manufacturer, highlights the increasing demand for EAGLEi’s advanced technology to ensure only carriers within tolerance enter production. EAGLEi 300 is used in prominent 300 mm fabrications worldwide and has established a benchmark for precise pre- and post-clean carrier measurement evaluation within the industry.
EAGLEi 300
Published: Wednesday, September 6, 2023 – 12:00